This course covers phases 1 and 2 of the smart card lifecycle: chip and card manufacturing.

Chip manufacturing covers:

• Chip design
• Smart card operating systems (COS)
• ROM masks and fabrication of the semiconductor chips
• Chip testing on the wafer
• Attaching chips to modules
• Encapsulating the chips in the modules
• Module testing

Card manufacturing covers:

• Card design and printing
• Tape layering
• Sheet collating
• Sheet lamination
• Card punching
• Hot stamping
• Chip module testing
• Chip milling and implanting
• Module lamination
• RFID testing
• Quality assurance
• Packaging and shipping to Perso bureau